Proficient Wafer Drying with Marangoni Dryers by Le Chatelier’s principle
Proficient Wafer Drying with Marangoni Dryers by Le Chatelier’s principle
Water Spot Free Surfaces by Marangoni Dryer
Your dream of a flawless surface free from water marks came true with the help of our company. Advanced Processing Equipment Technology has been preparing for the 300mm under 0.045 technology’s surface to be even more outstanding than before. The most adequate usage of Le Chatelier’s principle during the rinsing and drying procedure enables a precise control of wafer surface. Our Marangoni™ dryer is model NEO-2000-RD, gen.1.5. Our dHF Last, Rinse dryer is model NEO-3000-FRD, gen. 2.0. The integrated technology meets the requirements of advanced processes such as ultra-thin gate dielectric surface preparation, incorporating a wet etch back through a photo-resist mask, and water spot-free dispensing of devices with high-aspect-ratio features as well as Hard Disk drying.
IPA Vapor Dryer
Our Kimmon IPA vapor dryer demonstrates excellent process performance using IPA vapor condensation drying, that is either stand-alone or fully integrated with a rinsing and chemical process wet station. Previous particle and water spot data from several fab sites confirm that our technology meets the ITRS goals for 130-nm and sub-130-nm processing.
